Virtually disassemble iconic hardware, inspect every motherboard integrated circuit, delve into nanometer silicon die microarchitectures, and trace semiconductor supply chains in real-time WebGL.
Virtually disassemble the 7000-series aluminum chassis, explore the 10-layer HDI motherboard, and enter the dual-core Twister 6-wide superscalar A9 processor in high-precision 3D.
Explore 3D Device →The PC silicon revolution: Virtually disassemble the fanless aluminum chassis, open/close the Retina display lid, inspect the M1 logic board ICs, and enter the 16-billion-transistor Apple M1 SoC architecture in full 3D.
Explore 3D Device →Explore deep ray tracing silicon: 3rd-generation RT Cores, 4th-generation Tensor Cores, massive L2 cache hierarchies, and high-speed GDDR6X memory interfaces.
The ubiquitous Android semiconductor platform: integrated mmWave 5G baseband, Hexagon NPU tensor accelerators, Spectra ISP, and Adreno graphics.
Disassemble modern modular silicon: 5nm Core Complex Dies (CCDs) connected to a 6nm I/O Die over ultra-dense substrate interconnect traces.
High-reliability automotive silicon: dual lockstep neural accelerators, automotive camera serialization, and redundant power supplies designed for Level 4 autonomy.