Physical design is the stage of ASIC development where a gate-level netlist is transformed into a physical layout that a semiconductor foundry can manufacture. It is where the abstract logic becomes real transistors, wires, and masks — and one of the highest-demand, highest-paying disciplines in the semiconductor industry.
Where Does Physical Design Fit in the ASIC Flow?
The chip design flow has three major phases. Physical design occupies the entire backend — everything after logic synthesis and before the chip goes to the fab.
The Physical Design Flow Step by Step
Every ASIC physical design engagement follows the same sequence. The 15 days of this course teach each stage in depth — here is the full picture first:
STEP 01
Netlist Import
Read .v, LEF, Liberty, SDC
STEP 02
Floorplanning
Die size, I/O, macros
STEP 03
Power Planning
VDD/VSS rings & mesh
STEP 04
Placement
Timing-driven cell place
STEP 05
CTS
Clock tree, skew balance
STEP 06
Routing
Global + detailed
STEP 07
Post-Route Opt
Timing ECO, hold fix
STEP 08
Sign-off
STA, IR, DRC, LVS, LEC
STEP 09
GDSII Out
Stream out to foundry
Inputs to Physical Design
File / Input
Format
What it Contains
Gate-level netlist
.v
Synthesised circuit: instantiated standard cells and connections
Technology LEF
.lef
Process rules: layers, pitches, routing tracks, via rules
Cell LEF
.lef
Abstract views of standard cells and macros: bounding box, pin locations, blockages
Liberty library
.lib / .db
Cell timing models: delays, setup/hold, power — per PVT corner
Cadence Voltus / Synopsys Redhawk-SC — power integrity / IR drop analysis
What Does a Physical Design Engineer Actually Do?
On a typical project, a senior PD engineer does a mix of:
Floorplan and power planning — deciding where macros go, planning the power mesh to avoid IR drop violations under dynamic switching
Timing closure — iterating on placement and ECO to close setup and hold violations across all PVT corners
DRC debugging — resolving design-rule violations that occur during routing at advanced nodes
Tcl script development — most PD work is scripted. You write scripts to automate runs, parse reports, apply ECOs, check status.
Sign-off co-ordination — liaising with the STA, IR drop, DFT, and LEC teams to converge on a tapeout-ready database
Technology decisions — at advanced nodes (7nm, 5nm, 3nm), selecting standard cell height, double-patterning colour assignment, FinFET orientation
Starting an Innovus Session: Your First Commands
Physical design is almost entirely command-line driven in production environments. Here is what a typical Innovus design import looks like:
TCL — Cadence Innovus design import
# ── Load design ───────────────────────────────────────────
set_db init_design_netlist ../netlist/top.v
set_db init_mmmc_file ./mmmc.tcl
set_db init_lef_file {tech.lef cells.lef macros.lef}
init_design
# ── Verify design loaded correctly ────────────────────────
get_db designs .name ;# returns your top module name
get_db [get_db designs .] .insts ;# list all instances
The mmmc.tcl file defines your Multi-Corner Multi-Mode (MCMM) analysis views — the PVT corners and operating modes the tool will analyse. You will learn MCMM in detail on Day 6.
Key outputs: GDSII, SPEF, final DEF, post-route netlist, timing reports
Primary PnR tools: Cadence Innovus (most common in production) and Synopsys ICC2
Sign-off requires convergence of STA, IR drop, DRC/LVS, and LEC
Physical design is entirely Tcl-scripted — every professional PD engineer writes and maintains Tcl scripts daily
Frequently Asked Questions
What does a physical design engineer do?
A PD engineer takes a synthesized gate-level netlist and physically implements it on silicon: floorplanning, power planning, placing standard cells and macros, synthesising the clock tree, routing all signal and power nets, then signing off timing, IR drop, DRC, and LVS before handing the GDSII to the foundry.
What is the difference between RTL design and physical design?
RTL design describes chip behaviour in HDL (Verilog/VHDL) and is verified functionally. Physical design takes the synthesized gate-level netlist and places and routes actual transistors and metal wires on a specific process technology to produce a manufacturable GDSII layout. RTL has no concept of physical distance or wire delay — PD makes those real.
What tool is used for ASIC physical design?
The two industry-standard PnR tools are Cadence Innovus and Synopsys IC Compiler II (ICC2). Innovus is more widely deployed in production across a broad range of companies. For open-source flows, OpenROAD is increasingly used in academia and some production environments.
What are the main inputs to physical design?
The key inputs are: (1) Gate-level netlist from synthesis (.v), (2) Technology LEF (process design rules and metal stack), (3) Cell LEF (abstract views of standard cells and macros), (4) Liberty timing libraries (.lib/.db) per PVT corner, (5) SDC timing constraints, and (6) UPF for multi-voltage low-power designs.
What is GDSII?
GDSII (Graphic Data System II) is the industry-standard binary file format for IC layouts. It contains the geometric shapes on every process layer. The foundry uses GDSII to manufacture the photomasks used in wafer fabrication. OASIS is a newer, more compact alternative that is becoming preferred at advanced nodes due to much smaller file sizes.